The iTGV2027 International Glass Through-Hole Technology Innovation and Application Forum will be held in Wuxi（Wuxi International Conference Center）, China from May 12-14, 2027. The forum will feature one main forum, nine sub-forums:
- InternationalGlass Through-Hole Technology Innovation and Application Forum （iTGV2027）：iTGV2027 focuses on high-speed interconnection verification of advanced chips, panel-level glass interposers/glass bridges, packaging substrates and CPB. Adopting FLP/CoPoS panel-level packaging technologies, it will conduct large-scale, systematic and ecosystem-wide verification to tackle substrate warpage issues ahead of glass substrate mass production.
2. GCP Glass Circuit Board Technology Summit： centers on the innovative stacked glass PCB architecture and its reliable, stable mass-production process chain. It fundamentally addresses the longstanding large-area warpage issue of organic substrates and ushers in a new era of panel-level packaging based on next-generation glass substrates for large AI chips.
3. Glass-IP (Glass Interposer )Technology Summit：Glass-IP is a panel-level glass interposer, featuring a UTG-glass-based 2.5D packaging structure for high-density interconnection among advanced chips. Designed to replace traditional silicon interposers, it addresses warpage, heat dissipation and signal transmission issues in large-form-factor chip packaging. The Glass-IP Technology Summit will discuss engineering samples of glass interposers sized 310mm×310mm, 510mm×515mm and 600mm×3600mm.
4. CoPoS Technology Summit:CoPoS is regarded as the next-generation successor to TSMC’s flagship packaging technology CoWoS (Chip-on-Wafer-on-Substrate). Its core innovation lies in "transforming circles into squares" — replacing round silicon wafers adopted in conventional packaging with larger-area rectangular panels.The CoPoS Technology Summit will collaborate with the industry to drive mass production in phases based on different materials. In Phase 1, RDL/organic interposers targeted for 2028–2029 will enable the transition from round wafers to rectangular panels. Enabled by technological breakthroughs of glass substrates in next-gen panel-level packaging, glass interposers will be introduced into mass production for CoPoS interposer applications around 2030. Meanwhile, the substrate layer of CoPoS will also shift to glass-core substrates. Confronting key industrialization challenges head-on, the CoPoS Technology Summit joins forces with enterprises covering core process segments across the packaging supply chain to tackle technical bottlenecks jointly.
5. FOPLP Fan-Out Panel-Level Packaging Cooperation Forum:FOPLP Fan-Out Panel-Level Packaging Cooperation Forum is a cutting-edge conference focused on advanced packaging technologies, dedicated to advancing the industrialization of Fan-Out Panel Level Packaging (FOPLP). The forum brings together upstream and downstream enterprises from the global semiconductor industrial chain, research institutions and industry experts to conduct in-depth discussions on key topics including technological innovation, process optimization, material development, equipment upgrading and market applications of panel-level packaging.The forum places particular emphasis on the application of glass substrates in panel-level packaging. It explores how large-size rectangular panels can replace traditional round silicon wafers to boost packaging efficiency, cut costs and enable high-density integration. Discussion topics cover Through-Glass Via (TGV) technology, high-density interconnection, thermal management, process reliability, domestic equipment development, as well as packaging requirements for emerging sectors such as AI, HPC and automotive electronics.
6. iCPO International Optoelectronic Co-packaging Exchange Conference：This high-level international event specializes in optoelectronic integration and optoelectronic packaging. It centers on the frontier evolution and industrialization of CPO/NPO co-packaged optics. Discussions revolve around glass substrate applications in optoelectronic co-packaging, including scenarios such as data centers, telecommunications, autonomous driving and optical computing, alongside innovations in materials, processes and equipment.
7. Class-Bridge Technology Forum：Glass Bridge technology is a glass-based optical interconnection solution, mainly designed to address coupling challenges between photonic integrated circuits (PICs) and optical fibers. It holds vital application value particularly in the fields of co-packaged optics (CPO) and glass-based semiconductor packaging. The Glass Bridge Technology Forum will focus on cutting-edge applications of glass bridges in optical interconnection.
8. CoWoP Technology Forum：CoWoP serves as a vital evolutionary architecture bridging CoWoS and CoPoS. It inherits the mature wafer-level packaging processes of CoWoS while adopting large-area panel carriers, acting as a critical transitional technical route from circular wafer packaging to rectangular panel-level packaging. The summit brings together industry stakeholders to discuss process migration, material matching, yield optimization and mass production validation of Chip-on-Wafer-on-Panel technology, and explores viable approaches for progressive panelization in advanced packaging.
9. CoPoP Technology Forum：The CoPoP Technology Forum is a professional exchange platform focusing on Chip-on-Panel-on-PCB (CoPoP) technology in advanced packaging. It aims to advance the application and development of this technology for AI compute chip packaging.Discussions revolve around technical requirements, process challenges and material innovations of the glass-substrate-based CoPoP architecture. The forum explores how the combination of glass-based panel-level processing and PCB integration can deliver more streamlined and efficient packaging solutions to reduce signal path loss, improve thermal performance, and satisfy packaging requirements for large-size AI chips.
10. Glass-CoWoS Technology Forum。Glass-based wafer-level packaging is a concept contrasted with silicon-substrate wafer-level packaging. Based on wafer-level packaging architecture, it replaces silicon interposers with glass interposers. Compared with silicon interposers, it delivers higher bandwidth, finer line features, lower costs and an almost perfectly flat surface.
•Silicon Interposer→Glass Interposer
•Organic Substrate→Glass Substrate
•Silicon Interposer + Organic Substrate→Glass Pkg
•Silicon Interposer + Organic Substrate→Silicon Interposer + Organic
•Substrate + Glass Substrate
•Muti-glass Stacking （Glass PCB)