The iTGV2027 International Glass Through-Hole Technology Innovation and Application Forum will be held in Wuxi（Wuxi International Conference Center）, China from May 12-14, 2027. The forum will feature one main forum, nine sub-forums:
InternationalGlass Through-Hole Technology Innovation and Application Forum （iTGV2027）：iTGV2027 focuses on high-speed interconnection verification of advanced chips, panel-level glass interposers/glass bridges, packaging substrates and CPB. Adopting FLP/CoPoS panel-level packaging technologies, it will conduct large-scale, systematic and ecosystem-wide verification to tackle substrate warpage issues ahead of glass substrate mass production.
2. GCP Glass Circuit Board Technology Summit： centers on the innovative stacked glass PCB architecture and its reliable, stable mass-production process chain. It fundamentally addresses the longstanding large-area warpage issue of organic substrates and ushers in a new era of panel-level packaging based on next-generation glass substrates for large AI chips.
3. Glass-IP (Glass Interposer )Technology Summit：Glass-IP is a panel-level glass interposer, featuring a UTG-glass-based 2.5D packaging structure for high-density interconnection among advanced chips. Designed to replace traditional silicon interposers, it addresses warpage, heat dissipation and signal transmission issues in large-form-factor chip packaging. The Glass-IP Technology Summit will discuss engineering samples of glass interposers sized 310mm×310mm, 510mm×515mm and 600mm×3600mm. 