AMD董事長兼CEO蘇姿丰在2026年第三季度業績電話會上表示，預計Helios機架級AI系統的部署將在第四季度顯著增加。她在介紹交付進展時明確提到，隨著產量提升，聯想集團、HPE、戴爾、Supermicro等OEM及ODM合作夥伴將開始交付相關系統。
據蘇姿丰介紹，AMD已於第三季度開始批次交付MI455X GPU，Anthropic、Meta、微軟、OpenAI和甲骨文等客戶的首批Helios機櫃已投入運行，承載其模型和工作負載。第四季度，隨著合作夥伴啟動系統交付，Helios部署規模預計進一步擴大。 （科創板日報）
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