Sony Group Corp.(NYSE:SONY)andTaiwan Semiconductor Manufacturing Co.(NYSE:TSM) reportedly plan to invest $6.3 billion in a state-of-the-art image sensor semiconductor plant in Kumamoto, Japan.
索尼集團（NYSE:SONY）和台積電（NYSE:TSM）據報計劃投資$63億，在日本熊本縣建設一座尖端圖像傳感器半導體工廠。
Production at the new facility is slated to begin as early as 2029 and will be operated through a joint venture, with Sony holding a majority 60% stake and TSMC owning the remaining 40%, reported Nikkei Asia on Monday. The collaboration between the two companies was agreed upon in May.
據《日經亞洲》周一報導，新工廠的生產最早將於2029年開始，將通過一家合資企業運營，其中索尼持有60%的多數股權，台積電持有剩餘40%的股份。兩家公司已於5月達成此項合作。
The joint venture is likely to be established by the end of fiscal 2026, which runs through March 2027. The primary goal is to supply high-performance camera sensors forApple Inc.(NASDAQ:AAPL) iPhones, according to the report. The companies also aim to enhance sensor performance for improved object recognition by AI systems, targeting applications in the burgeoning field of "physical AI".
該合資企業預計將在截至2027年3月的2026財年結束前成立。據報告，其主要目標是為蘋果公司（納斯達克：AAPL）的iPhone供應高性能攝像頭傳感器。此外，雙方還致力於提升傳感器性能，以改善人工智慧系統的物體識別能力，瞄準蓬勃發展的「物理AI」領域。
The venture will build large-scale R&D facilities and production lines at Sony Semiconductor Solutions' image sensor plant in Kumamoto, Japan. Sony and TSMC are also discussing potential government subsidies with Japan's Ministry of Economy, Trade and Industry.
該合資企業將在日本熊本縣的索尼半導體解決方案公司圖像傳感器工廠內建設大規模研發設施和生產線。索尼和台積電也在與日本經濟產業省討論潛在的政府補貼事宜。
Sony and TSMC did not immediately respond to Benzinga's request for comments.
索尼和台積電未立即回應Benzinga的置評請求。
Read Also:Intel's Most Overlooked Edge Over TSMC Starts With Pat Gelsinger's 'Great Depression' Warning
參閱：英特爾被忽視的對TSMC的最大優勢始於Pat Gelsinger的「大蕭條」警告
TSMC Expands Japan Push Amid Chip Race
台積電在日本加大佈局，應對晶片競賽
Kumamoto has attracted semiconductor investment because of its water resources, infrastructure and established industrial base.
熊本縣因其水資源、基礎設施和成熟的工業基礎而吸引了半導體投資。
TSMC's most advanced 2nm and 3nm production remains centered in Taiwan and the U.S., while its Japan expansion focuses largely on specialty and mature technologies.
台積電最先進的2奈米和3奈米生產仍集中於臺灣和美國，而其在日本的擴張則主要聚焦於特種及成熟製程技術。
This announcement comes amid a competitive landscape in the tech industry. TSMC is reportedly developing an advanced chip-packaging technology called"EMIB-like", similar toIntel Corp.(NASDAQ:INTC)'s EMIB, in partnership with Taiwan-based Kinsus Interconnect Technology. The move could weaken Intel's edge in advanced packaging. Meanwhile, Nvidia is reportedly evaluating Intel's EMIB technology for a future processor.
此項公告正值科技行業競爭激烈之際。據報導，台積電正與臺灣的Kinsus Interconnect Technology合作開發一種名為「EMIB-like」的先進晶片封裝技術，類似於英特爾公司（納斯達克：INTC）的EMIB技術。此舉可能削弱英特爾在先進封裝領域的優勢。與此同時，輝達據報正在評估英特爾的EMIB技術，用於未來的處理器。
Meanwhile,Samsung Electronics Co. Ltd.(OTC:SSNLF) andBroadcom(NASDAQ:AVGO) have entered a $200 billion AI chip pact through 2030, intensifying the foundry race with TSMC.
與此同時，三星電子有限公司（場外交易：SSNLF）和博通（納斯達克：AVGO）已達成一項$2,000億 AI晶片協議，有效期至2030年，進一步加劇了與台積電的代工競賽。 (Benzinga)